EU Funding & Tenders Portal · DIGITAL-JU-CHIPS-2026-SG-JAPAN

International collaboration EU and Japan on semiconductors

Code

DIGITAL-JU-CHIPS-2026-SG-JAPAN

Programme

Digital Europe Programme (DIGITAL)

Status

Open

Opens

2026-07-07

Deadline

2026-12-08 (50 days left; time on the official page)

Budget

5 000 000 €

Grant size

3 000 000 € – 5 000 000 €

Key dates

1. 2026-07-07Opens
2. 2026-12-08Deadline

Eligibility check

No verified eligibility rules for this call yet. See the official guidelines.

Description

Expected Outcome:

Projects are expected to contribute to the following expected outcomes:

Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.

Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Text from the official source. Only the official documents are legally binding.

Official data · EU Funding & Tenders Portal · synced 2026-10-19 03:27 · official record · Licence: © European Union. Reuse with attribution (Commission Decision 2011/833/EU).